-01Możliwości

Możliwości HDI i mikrootworów

Sprawdź możliwości w zakresie „Możliwości HDI i mikrootworów”, wymagane dane projektu i parametry, które trzeba potwierdzić dla zamówienia.

-02Capabilities Hdi

Capability data

DatasetParameterSampleMass production

Conventional rigid PCB capabilityLayer Count50L36L

Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm

Conventional rigid PCB capabilityThickness Tolerance±8%±8%

Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil

Conventional rigid PCB capabilityMin Hole-to-Trace Clearance5mil5mil

Conventional rigid PCB capabilityCopper Weight1-12oz1/3-8oz

Conventional rigid PCB capabilityLayer Registration Accuracy0.8mil1mil

Conventional rigid PCB capabilityMin Through Hole Diameter0.075mm0.10mm

Flexible PCB capabilityLayer Count1216

Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5

Flexible PCB capabilityMinimum BGA Pitch (μm)150100

Flexible PCB capabilityMinimum Board Thickness (μm)5050

Flexible PCB capabilityMaximum Panel Size (mm)610×1200610×1200

Flexible PCB capabilityMinimum Base Copper Thickness (μm)96

Flexible PCB capabilityMaximum Base Copper Thickness (μm)3535

Flexible PCB capabilityMinimum Trace/Space (μm)40/4035/35

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-03Products Pcb

-04Process

-05RFQ

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.