-01Branże

PCB do systemów embedded i Mini PC

Sprawdź możliwości w zakresie „PCB do systemów embedded i Mini PC”, wymagane dane projektu i parametry, które trzeba potwierdzić dla zamówienia.

Panel złoconych płytek sterujących bezzałogowych statków powietrznych

-02Industry

Applications

-03Capabilities Summary

Capability data

DatasetParameterSampleMass production
Conventional rigid PCB capabilityLayer Count50L36L
Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm
Conventional rigid PCB capabilityThickness Tolerance±8%±8%
Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
Flexible PCB capabilityLayer Count1216
Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5
Flexible PCB capabilityMinimum BGA Pitch (μm)150100
Flexible PCB capabilityMinimum Board Thickness (μm)5050
Rigid-flex PCB capabilityLayer Count20L18L
Rigid-flex PCB capabilityPanel Size400×540mm400×540mm
Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm
Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-04Products Pcb

Approved media

Bezzałogowy statek powietrzny w locie
Panel płytek modułów IoT ze złotym wykończeniem powierzchni
Złocona matryca styków SMD na gotowej płytce

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.