-01Capabilities

Controlled Impedance PCB

Review Controlled Impedance PCB capabilities, required project inputs, and the evidence that must be confirmed for your order.

Network analyser set up for high-frequency board measurement

-02Capabilities Impedance

Capability data

DatasetParameterSampleMass production
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm
High-frequency and high-speed PCB capabilitySlot ToleranceNormal Slot ±0.08, Routing Slot ±0.10Normal Slot ±0.10, Routing Slot ±0.13
High-frequency and high-speed PCB capabilityLayer Registration2mil3mil
High-frequency and high-speed PCB capabilityHybrid LaminationPTFE + Glass Ceramic + FR4PTFE + Glass Ceramic + FR4
High-frequency and high-speed PCB capabilityMinimum Hole Size0.075mm0.10mm
High-frequency and high-speed PCB capabilityMinimum Hole Spacing0.20mm0.25mm
High-frequency and high-speed PCB capabilityHole Diameter Tolerance±0.05mm±0.075mm
High-frequency and high-speed PCB capabilityMaximum Aspect Ratio16:112:1
High-frequency and high-speed PCB capabilityHole Copper UniformityCOV≤5%COV≤7%
High-frequency and high-speed PCB capabilityResin Filled Via Aspect Ratio12:112:1
High-frequency and high-speed PCB capabilityVia TypeThrough Hole / Blind ViaThrough Hole / Blind Via
High-frequency and high-speed PCB capabilityTrace Width Tolerance±0.6mil±1mil
High-frequency and high-speed PCB capabilityImpedance Tolerance±5%±8%

No effective date is present in the supplied CSV; confirm values before publication or quotation.

-03Products Pcb

Approved media

Network analyser set up for high-frequency board measurement
RF board with serpentine length-matched traces
Vision measurement system checking board dimensions

-04Process

From prototype to production

  1. 01

    File review

  2. 02

    Engineering questions

  3. 03

    Stack-up and material confirmation

  4. 04

    Fabrication

  5. 05

    Inspection and test

  6. 06

    Packing and delivery

Flowchart of the rigid PCB manufacturing process

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.