Guangdong PCB manufacturing with a Shenzhen branch serving Central and Eastern EuropeShenzhen, Guangdong+86 1772-254-5366Sales@shinepcba.com

-01Industries

PCBs for Home Electronics

Review PCBs for Home Electronics capabilities, required project inputs, and the evidence that must be confirmed for your order.

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Panelised smartphone mainboards before singulation

-02Industry

Applications

Industrial automation and robotics application areaIndustry

PCBs for Industrial Electronics

Application fit requires project evidence; no customer relationship is implied.

Satellite communication antenna installationIndustry

PCBs for Radar and RF Systems

Application fit requires project evidence; no customer relationship is implied.

Data-processing server board with dual processor socketsIndustry

PCBs for High-Speed Computing

Application fit requires project evidence; no customer relationship is implied.

Unmanned aerial vehicle in flightIndustry

PCBs for Embedded and Mini PC Systems

Application fit requires project evidence; no customer relationship is implied.

LED board array with populated emittersIndustry

PCBs for Lighting Electronics

Application fit requires project evidence; no customer relationship is implied.

-03Capabilities Summary

Capability data

DatasetParameterSampleMass production
Conventional rigid PCB capabilityLayer Count50L36L
Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm
Conventional rigid PCB capabilityThickness Tolerance±8%±8%
Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
Flexible PCB capabilityLayer Count1216
Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5
Flexible PCB capabilityMinimum BGA Pitch (μm)150100
Flexible PCB capabilityMinimum Board Thickness (μm)5050
Rigid-flex PCB capabilityLayer Count20L18L
Rigid-flex PCB capabilityPanel Size400×540mm400×540mm
Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm
Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-04Products Pcb

Approved media

Circuit boards from consumer electronics products
Panel of wearable-device boards with gold surface finish
Circuit board for a head-mounted display device

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.

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