Guangdong PCB manufacturing with a Shenzhen branch serving Central and Eastern EuropeShenzhen, Guangdong+86 1772-254-5366Sales@shinepcba.com

-01Capabilities

PCB Back Drilling

Review PCB Back Drilling capabilities, required project inputs, and the evidence that must be confirmed for your order.

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Multi-spindle drilling machine producing PCB holes

-02Capabilities Back Drilling

Capability data

DatasetParameterSampleMass production
Conventional rigid PCB capabilityLayer Count50L36L
Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm
Conventional rigid PCB capabilityThickness Tolerance±8%±8%
Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
Conventional rigid PCB capabilityMin Hole-to-Trace Clearance5mil5mil
Conventional rigid PCB capabilityCopper Weight1-12oz1/3-8oz
Conventional rigid PCB capabilityLayer Registration Accuracy0.8mil1mil
Conventional rigid PCB capabilityMin Through Hole Diameter0.075mm0.10mm
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm
High-frequency and high-speed PCB capabilitySlot ToleranceNormal Slot ±0.08, Routing Slot ±0.10Normal Slot ±0.10, Routing Slot ±0.13
High-frequency and high-speed PCB capabilityLayer Registration2mil3mil
High-frequency and high-speed PCB capabilityHybrid LaminationPTFE + Glass Ceramic + FR4PTFE + Glass Ceramic + FR4
High-frequency and high-speed PCB capabilityMinimum Hole Size0.075mm0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-03Products Pcb

Approved media

Multi-spindle drilling machine producing PCB holes
Diagram of via stub effects addressed by back drilling
Cross-section of a plated via used for microsection analysis

-04Process

From prototype to production

  1. 01

    File review

  2. 02

    Engineering questions

  3. 03

    Stack-up and material confirmation

  4. 04

    Fabrication

  5. 05

    Inspection and test

  6. 06

    Packing and delivery

Flowchart of the rigid PCB manufacturing process

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.

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