-01Engineering

PCB Stack-Up Engineering

Review PCB Stack-Up Engineering capabilities, required project inputs, and the evidence that must be confirmed for your order.

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Multilayer lamination press used to bond PCB stack-ups

-02Process

Engineering release process

01
File review
02
Engineering questions
03
Stack-up and material confirmation
04
Fabrication
05
Inspection and test
06
Packing and delivery

Diagram of the factors that affect PCB signal integrity

-03Capabilities Summary

Capability data

DatasetParameterSampleMass production

Conventional rigid PCB capabilityLayer Count50L36L

Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm

Conventional rigid PCB capabilityThickness Tolerance±8%±8%

Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil

Flexible PCB capabilityLayer Count1216

Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5

Flexible PCB capabilityMinimum BGA Pitch (μm)150100

Flexible PCB capabilityMinimum Board Thickness (μm)5050

Rigid-flex PCB capabilityLayer Count20L18L

Rigid-flex PCB capabilityPanel Size400×540mm400×540mm

Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm

Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil

High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber

High-frequency and high-speed PCB capabilityLayer Count24L20L

High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm

High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-04Planned resources