-01Materials

PCB Materials

Review PCB Materials capabilities, required project inputs, and the evidence that must be confirmed for your order.

Copper-clad laminate panels used for PCB fabrication

-02Materials Catalog

Material properties

MaterialReference modelsTypical fitReview focusRFQ note
Standard FR-4FR-4 Tg 135, FR-4 Tg 150, Shengyi S1000-2, Kingboard KB-6160, ITEQ IT-158, Nan Ya NP-155General digital, control, consumer, and cost-sensitive multilayer PCB builds.Tg class, CTI, CAF resistance, lead-free reflow count, copper weight, UL file requirements.Treat brand and exact laminate code as RFQ-confirmed options, not guaranteed inventory.
High-Tg FR-4FR-4 Tg 170, FR-4 Tg 180, Isola IS410, Isola 370HR, ITEQ IT-180A, Panasonic R-1755VLead-free assembly, automotive, industrial controls, thick boards, and repeat reflow.Tg method, Td, Z-axis CTE, T288/T300, CAF resistance, drilling reliability.Use high-Tg when thermal stress or via reliability matters more than lowest laminate cost.
Rogers RF laminatesRogers RO4003C, Rogers RO4350B, Rogers RO3003, Rogers RO3006, Rogers RT/duroid 5880Antenna, RF front-end, microwave, radar, GNSS, and controlled-loss circuits.Operating frequency, Dk/Df, copper profile, plated-hole process, hybrid stack-up plan.RO4000 materials are different from PTFE laminates; process route must be checked by stack-up.
Isola high-speed and RFIsola IS410, Isola 370HR, Isola FR408HR, Isola I-Tera MT40, Isola Astra MT77, Isola Tachyon 100GHigh-reliability FR-4, low-loss digital, high-speed backplanes, RF and mmWave designs.Dk target, insertion loss, spread glass, copper roughness, CAF, lead-free cycles.Use exact Isola grade only after confirming material availability and required documentation.
PTFE and ceramic-filled PTFERogers RT/duroid 5870, Rogers RT/duroid 5880, Rogers RO3003, Rogers RO3006, Taconic TLX, Taconic TLYLow-loss RF, broadband microwave, mmWave, satellite, radar, and specialist antenna work.PTFE handling, hole preparation, dimensional stability, copper adhesion, hybrid bonding.PTFE materials do not behave like standard FR-4 and require process confirmation.

These are common material classes and reference laminate models for RFQ discussion. Exact brand, grade, stack-up, certificate scope, and availability are confirmed per project.

-03Industry

Applications

-04Capabilities Summary

Capability data

DatasetParameterSampleMass production
Conventional rigid PCB capabilityLayer Count50L36L
Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm
Conventional rigid PCB capabilityThickness Tolerance±8%±8%
Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
Flexible PCB capabilityLayer Count1216
Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5
Flexible PCB capabilityMinimum BGA Pitch (μm)150100
Flexible PCB capabilityMinimum Board Thickness (μm)5050
Rigid-flex PCB capabilityLayer Count20L18L
Rigid-flex PCB capabilityPanel Size400×540mm400×540mm
Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm
Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.