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-01Materials

Rogers PCB Material

Review Rogers PCB Material capabilities, required project inputs, and the evidence that must be confirmed for your order.

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High-frequency laminate build illustration

-02Materials Rogers

Material properties

MaterialReference modelsTypical fitReview focusRFQ note
Rogers RO4000 familyRogers RO4003C, Rogers RO4350B, Rogers RO4835, Rogers RO4360G2RF, antenna, power amplifier, GNSS, and hybrid RF plus FR-4 stack-ups.Dk/Df at frequency, UL requirement, oxidation resistance, bonding film, hybrid stack-up.RO4000 materials are generally more FR-4-process-compatible than PTFE-based materials.
Rogers RO3000 and RT/duroidRogers RO3003, Rogers RO3006, Rogers RT/duroid 5870, Rogers RT/duroid 5880Low-loss microwave, mmWave, radar, and satellite communication circuits.PTFE process route, dimensional stability, copper foil, plasma/desmear, hole reliability.Confirm construction, prepreg or bondply, copper, and availability for each RFQ.

These are common material classes and reference laminate models for RFQ discussion. Exact brand, grade, stack-up, certificate scope, and availability are confirmed per project.

-03Industry

Applications

Industrial automation and robotics application areaIndustry

PCBs for Industrial Electronics

Application fit requires project evidence; no customer relationship is implied.

Satellite communication antenna installationIndustry

PCBs for Radar and RF Systems

Application fit requires project evidence; no customer relationship is implied.

Data-processing server board with dual processor socketsIndustry

PCBs for High-Speed Computing

Application fit requires project evidence; no customer relationship is implied.

Unmanned aerial vehicle in flightIndustry

PCBs for Embedded and Mini PC Systems

Application fit requires project evidence; no customer relationship is implied.

LED board array with populated emittersIndustry

PCBs for Lighting Electronics

Application fit requires project evidence; no customer relationship is implied.

Circuit boards from consumer electronics productsIndustry

PCBs for Home Electronics

Application fit requires project evidence; no customer relationship is implied.

-04Capabilities Summary

Capability data

DatasetParameterSampleMass production
Conventional rigid PCB capabilityLayer Count50L36L
Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm
Conventional rigid PCB capabilityThickness Tolerance±8%±8%
Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
Flexible PCB capabilityLayer Count1216
Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5
Flexible PCB capabilityMinimum BGA Pitch (μm)150100
Flexible PCB capabilityMinimum Board Thickness (μm)5050
Rigid-flex PCB capabilityLayer Count20L18L
Rigid-flex PCB capabilityPanel Size400×540mm400×540mm
Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm
Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.

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