-01Products

RF and Microwave PCB Manufacturing

Review RF and Microwave PCB Manufacturing capabilities, required project inputs, and the evidence that must be confirmed for your order.

RF board with serpentine length-matched traces

-02Capabilities Rf

Capability data

DatasetParameterSampleMass production
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm
High-frequency and high-speed PCB capabilitySlot ToleranceNormal Slot ±0.08, Routing Slot ±0.10Normal Slot ±0.10, Routing Slot ±0.13
High-frequency and high-speed PCB capabilityLayer Registration2mil3mil
High-frequency and high-speed PCB capabilityHybrid LaminationPTFE + Glass Ceramic + FR4PTFE + Glass Ceramic + FR4
High-frequency and high-speed PCB capabilityMinimum Hole Size0.075mm0.10mm
High-frequency and high-speed PCB capabilityMinimum Hole Spacing0.20mm0.25mm
High-frequency and high-speed PCB capabilityHole Diameter Tolerance±0.05mm±0.075mm
High-frequency and high-speed PCB capabilityMaximum Aspect Ratio16:112:1
High-frequency and high-speed PCB capabilityHole Copper UniformityCOV≤5%COV≤7%
High-frequency and high-speed PCB capabilityResin Filled Via Aspect Ratio12:112:1
High-frequency and high-speed PCB capabilityVia TypeThrough Hole / Blind ViaThrough Hole / Blind Via
High-frequency and high-speed PCB capabilityTrace Width Tolerance±0.6mil±1mil
High-frequency and high-speed PCB capabilityImpedance Tolerance±5%±8%

No effective date is present in the supplied CSV; confirm values before publication or quotation.

-03Products Pcb

Approved media

RF microwave board with ENIG surface finish
RF amplifier board with gold surface finish
RF board with a gold-plated ground plane

-04Industry

Applications

-05Process

From prototype to production

  1. 01

    File review

  2. 02

    Engineering questions

  3. 03

    Stack-up and material confirmation

  4. 04

    Fabrication

  5. 05

    Inspection and test

  6. 06

    Packing and delivery

Flowchart of the rigid PCB manufacturing process

-06RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.