Leiterplattenfertigung in Guangdong mit Niederlassung in Shenzhen für Mittel- und OsteuropaShenzhen, Guangdong+86 1772-254-5366Sales@shinepcba.com

-01Materialien

FR-4-Leiterplattenmaterial

Prüfen Sie die Möglichkeiten für „FR-4-Leiterplattenmaterial“, die benötigten Projektdaten und die für Ihren Auftrag zu bestätigenden Angaben.

Angebot anfordernGerber-Daten senden
FR-4-Leiterplatte mit bedrahteten und SMD-Bauteilen

-02Materials Fr4

Material properties

MaterialReference modelsTypical fitReview focusRFQ note
Standard FR-4 Tg 135-150FR-4 Tg 135, FR-4 Tg 150, Shengyi S1000-2, Kingboard KB-6160, ITEQ IT-158, Nan Ya NP-155Mainstream rigid PCB builds with standard electrical and thermal requirements.Tg class, UL 94 V-0, CTI, CAF, copper weight, lead-free reflow exposure.Exact laminate brand is selected during stack-up and quotation review.
Lead-free FR-4 upgradeIsola IS410, Isola 370HR, Panasonic R-1755V, ITEQ IT-180AAssemblies with higher reflow stress or more demanding reliability expectations.Tg/Td, Z-axis expansion, T288/T300, via reliability, material certificate needs.This is a reference set, not a public stock promise.

These are common material classes and reference laminate models for RFQ discussion. Exact brand, grade, stack-up, certificate scope, and availability are confirmed per project.

-03Industry

Applications

Anwendungsbereich Industrieautomation und RobotikIndustry

Leiterplatten für Industrieelektronik

Application fit requires project evidence; no customer relationship is implied.

SatellitenkommunikationsantenneIndustry

Leiterplatten für Radar- und HF-Systeme

Application fit requires project evidence; no customer relationship is implied.

Serverleiterplatte für Datenverarbeitung mit zwei ProzessorsockelnIndustry

Leiterplatten für High-Speed-Computing

Application fit requires project evidence; no customer relationship is implied.

Unbemanntes Luftfahrzeug im FlugIndustry

Leiterplatten für Embedded- und Mini-PC-Systeme

Application fit requires project evidence; no customer relationship is implied.

LED-Leiterplattenarray mit bestückten EmitternIndustry

Leiterplatten für Beleuchtungselektronik

Application fit requires project evidence; no customer relationship is implied.

Leiterplatten aus Produkten der UnterhaltungselektronikIndustry

Leiterplatten für Heimelektronik

Application fit requires project evidence; no customer relationship is implied.

-04Capabilities Summary

Capability data

DatasetParameterSampleMass production
Conventional rigid PCB capabilityLayer Count50L36L
Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm
Conventional rigid PCB capabilityThickness Tolerance±8%±8%
Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
Flexible PCB capabilityLayer Count1216
Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5
Flexible PCB capabilityMinimum BGA Pitch (μm)150100
Flexible PCB capabilityMinimum Board Thickness (μm)5050
Rigid-flex PCB capabilityLayer Count20L18L
Rigid-flex PCB capabilityPanel Size400×540mm400×540mm
Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm
Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.

Gerber-Daten sendenAngebot anfordern