-01Fertigung

Backdrilling für Leiterplatten

Prüfen Sie die Möglichkeiten für „Backdrilling für Leiterplatten“, die benötigten Projektdaten und die für Ihren Auftrag zu bestätigenden Angaben.

Mehrspindel-Bohrmaschine zur Herstellung von Leiterplattenbohrungen

-02Capabilities Back Drilling

Capability data

DatasetParameterSampleMass production
Conventional rigid PCB capabilityLayer Count50L36L
Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm
Conventional rigid PCB capabilityThickness Tolerance±8%±8%
Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
Conventional rigid PCB capabilityMin Hole-to-Trace Clearance5mil5mil
Conventional rigid PCB capabilityCopper Weight1-12oz1/3-8oz
Conventional rigid PCB capabilityLayer Registration Accuracy0.8mil1mil
Conventional rigid PCB capabilityMin Through Hole Diameter0.075mm0.10mm
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm
High-frequency and high-speed PCB capabilitySlot ToleranceNormal Slot ±0.08, Routing Slot ±0.10Normal Slot ±0.10, Routing Slot ±0.13
High-frequency and high-speed PCB capabilityLayer Registration2mil3mil
High-frequency and high-speed PCB capabilityHybrid LaminationPTFE + Glass Ceramic + FR4PTFE + Glass Ceramic + FR4
High-frequency and high-speed PCB capabilityMinimum Hole Size0.075mm0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-03Products Pcb

Approved media

Mehrspindel-Bohrmaschine zur Herstellung von Leiterplattenbohrungen
Diagramm der Via-Stub-Effekte, die durch Backdrilling beseitigt werden
Querschliff einer durchkontaktierten Bohrung für die Mikroschliffanalyse

-04Process

Vom Prototyp zur Serie

  1. 01

    Datenprüfung

  2. 02

    Technische Rückfragen

  3. 03

    Bestätigung von Lagenaufbau und Material

  4. 04

    Fertigung

  5. 05

    Inspektion und Prüfung

  6. 06

    Verpackung und Lieferung

Ablaufdiagramm des Herstellungsprozesses starrer Leiterplatten

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.