-01Produkte

Starrflex-Leiterplattenfertigung

Prüfen Sie die Möglichkeiten für „Starrflex-Leiterplattenfertigung“, die benötigten Projektdaten und die für Ihren Auftrag zu bestätigenden Angaben.

Angebot anfordern Gerber-Daten senden

Flexible Leiterplattenbaugruppe auf Polyimidsubstrat

-02Capabilities Rigid Flex

Capability data

DatasetParameterSampleMass production

Rigid-flex PCB capabilityLayer Count20L18L

Rigid-flex PCB capabilityPanel Size400×540mm400×540mm

Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm

Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil

Rigid-flex PCB capabilityMin Hole-to-Trace Clearance4mil5mil

Rigid-flex PCB capabilityCopper Weight1/3-3oz1/3-2oz

Rigid-flex PCB capabilityLayer Registration Accuracy0.8mil1mil

Rigid-flex PCB capabilityMin Through Hole Diameter0.075mm0.10mm

Rigid-flex PCB capabilityMin Laser Via Diameter0.05mm0.05mm

Rigid-flex PCB capabilityMax Aspect Ratio16:112:1

Rigid-flex PCB capabilityEtching Tolerance±10%/±0.8mil±10%/±1mil

Rigid-flex PCB capabilityMin Solder Bridge2mil3mil

Rigid-flex PCB capabilityImpedance Control Tolerance±5%±7%

Rigid-flex PCB capabilitySurface FinishENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, CarbonENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP

Rigid-flex PCB capabilitySupported StructuresSingle-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed DesignSingle-sided Core, Symmetrical Stack-up, Multilayer Stack-up, Gold Finger, Air Gap, Asymmetrical Stack-up, HDI Structure, Build-up Structure, Bookbinder Structure, High-speed Design

Rigid-flex PCB capabilityMaterial TypesShengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, ArlonShengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-03Products Pcb