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-01Materialien

High-Tg-Leiterplattenmaterial

Prüfen Sie die Möglichkeiten für „High-Tg-Leiterplattenmaterial“, die benötigten Projektdaten und die für Ihren Auftrag zu bestätigenden Angaben.

Angebot anfordernGerber-Daten senden
Darstellung von Kupferfolie und Dickkupferaufbau

-02Materials High Tg

Material properties

MaterialReference modelsTypical fitReview focusRFQ note
High-Tg FR-4 Tg 170+FR-4 Tg 170, FR-4 Tg 180, Isola IS410, Isola 370HR, ITEQ IT-180A, Panasonic R-1755VAutomotive, industrial, power, thick-board, and multiple lead-free reflow applications.Tg test method, Td, Z-axis CTE, T260/T288/T300, CAF, drill aspect ratio.Select by thermal stress and reliability target, not only by nominal Tg.
High-reliability FR-4Isola 370HR, Isola FR408HR, Shengyi S1000H, Ventec VT-47Dense multilayer boards where via reliability and process margin matter.resin system, copper roughness, impedance tolerance, laminate certificate requirement.Equivalent materials may be proposed after engineering review.

These are common material classes and reference laminate models for RFQ discussion. Exact brand, grade, stack-up, certificate scope, and availability are confirmed per project.

-03Industry

Applications

Anwendungsbereich Industrieautomation und RobotikIndustry

Leiterplatten für Industrieelektronik

Application fit requires project evidence; no customer relationship is implied.

SatellitenkommunikationsantenneIndustry

Leiterplatten für Radar- und HF-Systeme

Application fit requires project evidence; no customer relationship is implied.

Serverleiterplatte für Datenverarbeitung mit zwei ProzessorsockelnIndustry

Leiterplatten für High-Speed-Computing

Application fit requires project evidence; no customer relationship is implied.

Unbemanntes Luftfahrzeug im FlugIndustry

Leiterplatten für Embedded- und Mini-PC-Systeme

Application fit requires project evidence; no customer relationship is implied.

LED-Leiterplattenarray mit bestückten EmitternIndustry

Leiterplatten für Beleuchtungselektronik

Application fit requires project evidence; no customer relationship is implied.

Leiterplatten aus Produkten der UnterhaltungselektronikIndustry

Leiterplatten für Heimelektronik

Application fit requires project evidence; no customer relationship is implied.

-04Capabilities Summary

Capability data

DatasetParameterSampleMass production
Conventional rigid PCB capabilityLayer Count50L36L
Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm
Conventional rigid PCB capabilityThickness Tolerance±8%±8%
Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
Flexible PCB capabilityLayer Count1216
Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5
Flexible PCB capabilityMinimum BGA Pitch (μm)150100
Flexible PCB capabilityMinimum Board Thickness (μm)5050
Rigid-flex PCB capabilityLayer Count20L18L
Rigid-flex PCB capabilityPanel Size400×540mm400×540mm
Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm
Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.

Gerber-Daten sendenAngebot anfordern