Leiterplattenfertigung in Guangdong mit Niederlassung in Shenzhen für Mittel- und OsteuropaShenzhen, Guangdong+86 1772-254-5366Sales@shinepcba.com

-01Branchen

Leiterplatten für Radar- und HF-Systeme

Prüfen Sie die Möglichkeiten für „Leiterplatten für Radar- und HF-Systeme“, die benötigten Projektdaten und die für Ihren Auftrag zu bestätigenden Angaben.

Angebot anfordernGerber-Daten senden
Runde Radarsensor-Leiterplatte mit konzentrischen Antennenstrukturen

-02Industry

Applications

Anwendungsbereich Industrieautomation und RobotikIndustry

Leiterplatten für Industrieelektronik

Application fit requires project evidence; no customer relationship is implied.

Serverleiterplatte für Datenverarbeitung mit zwei ProzessorsockelnIndustry

Leiterplatten für High-Speed-Computing

Application fit requires project evidence; no customer relationship is implied.

Unbemanntes Luftfahrzeug im FlugIndustry

Leiterplatten für Embedded- und Mini-PC-Systeme

Application fit requires project evidence; no customer relationship is implied.

LED-Leiterplattenarray mit bestückten EmitternIndustry

Leiterplatten für Beleuchtungselektronik

Application fit requires project evidence; no customer relationship is implied.

Leiterplatten aus Produkten der UnterhaltungselektronikIndustry

Leiterplatten für Heimelektronik

Application fit requires project evidence; no customer relationship is implied.

-03Capabilities Rf

Capability data

DatasetParameterSampleMass production
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm
High-frequency and high-speed PCB capabilitySlot ToleranceNormal Slot ±0.08, Routing Slot ±0.10Normal Slot ±0.10, Routing Slot ±0.13
High-frequency and high-speed PCB capabilityLayer Registration2mil3mil
High-frequency and high-speed PCB capabilityHybrid LaminationPTFE + Glass Ceramic + FR4PTFE + Glass Ceramic + FR4
High-frequency and high-speed PCB capabilityMinimum Hole Size0.075mm0.10mm
High-frequency and high-speed PCB capabilityMinimum Hole Spacing0.20mm0.25mm
High-frequency and high-speed PCB capabilityHole Diameter Tolerance±0.05mm±0.075mm
High-frequency and high-speed PCB capabilityMaximum Aspect Ratio16:112:1
High-frequency and high-speed PCB capabilityHole Copper UniformityCOV≤5%COV≤7%
High-frequency and high-speed PCB capabilityResin Filled Via Aspect Ratio12:112:1
High-frequency and high-speed PCB capabilityVia TypeThrough Hole / Blind ViaThrough Hole / Blind Via
High-frequency and high-speed PCB capabilityTrace Width Tolerance±0.6mil±1mil
High-frequency and high-speed PCB capabilityImpedance Tolerance±5%±8%

No effective date is present in the supplied CSV; confirm values before publication or quotation.

-04Products Pcb

Approved media

Satellitenkommunikationsantenne
Leiterplatte für Satellitenkommunikationsgeräte im niedrigen Erdorbit
Leiterplatte für Glasfaser-Übertragungstechnik

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.

Gerber-Daten sendenAngebot anfordern