-01Produkte

Leiterplatten-Prototypenfertigung

Prüfen Sie die Möglichkeiten für „Leiterplatten-Prototypenfertigung“, die benötigten Projektdaten und die für Ihren Auftrag zu bestätigenden Angaben.

Angebot anfordern Gerber-Daten senden

Grüner Leiterplattennutzen für die SMT-Bestückung

-02Capabilities Prototype

Capability data

DatasetParameterSampleMass production

Conventional rigid PCB capabilityLayer Count50L36L

Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm

Conventional rigid PCB capabilityThickness Tolerance±8%±8%

Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil

Flexible PCB capabilityLayer Count1216

Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5

Flexible PCB capabilityMinimum BGA Pitch (μm)150100

Flexible PCB capabilityMinimum Board Thickness (μm)5050

Rigid-flex PCB capabilityLayer Count20L18L

Rigid-flex PCB capabilityPanel Size400×540mm400×540mm

Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm

Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil

High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber

High-frequency and high-speed PCB capabilityLayer Count24L20L

High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm

High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-03Products Pcb

Approved media

Handhabung unbestückter Leiterplatten zwischen Fertigungsschritten

Verpackungslinie zur Versandvorbereitung fertiger Leiterplatten

-04Industry