-01Materialien

PTFE-Leiterplattenmaterial

Prüfen Sie die Möglichkeiten für „PTFE-Leiterplattenmaterial“, die benötigten Projektdaten und die für Ihren Auftrag zu bestätigenden Angaben.

Angebot anfordern Gerber-Daten senden

HF-Mikrowellenleiterplatte mit ENIG-Oberfläche

-02Materials Ptfe

Material properties

MaterialReference modelsTypical fitReview focusRFQ note

PTFE microwave laminatesRogers RT/duroid 5870, Rogers RT/duroid 5880, Taconic TLX, Taconic TLY, Taconic RFBroadband RF, low-loss microwave, antennas, satellite, aerospace, and radar modules.PTFE drilling/plating preparation, dimensional movement, copper adhesion, bondply choice.PTFE requires a different process review from standard FR-4.

Ceramic-filled PTFERogers RO3003, Rogers RO3006, Rogers RO3010, Taconic CER-10Stable Dk RF boards, mmWave sensors, filters, couplers, and radar circuits.Dk tolerance, frequency, thickness tolerance, copper profile, multilayer registration.Material substitution needs electrical sign-off, not only similar nominal Dk.

These are common material classes and reference laminate models for RFQ discussion. Exact brand, grade, stack-up, certificate scope, and availability are confirmed per project.

-03Industry

Applications

Anwendungsbereich Industrieautomation und Robotik

Leiterplatten für Industrieelektronik

Application fit requires project evidence; no customer relationship is implied.

Satellitenkommunikationsantenne

Leiterplatten für Radar- und HF-Systeme

Application fit requires project evidence; no customer relationship is implied.

Serverleiterplatte für Datenverarbeitung mit zwei Prozessorsockeln

Leiterplatten für High-Speed-Computing

Application fit requires project evidence; no customer relationship is implied.

Unbemanntes Luftfahrzeug im Flug

Leiterplatten für Embedded- und Mini-PC-Systeme

Application fit requires project evidence; no customer relationship is implied.

LED-Leiterplattenarray mit bestückten Emittern

Leiterplatten für Beleuchtungselektronik

Application fit requires project evidence; no customer relationship is implied.

Leiterplatten aus Produkten der Unterhaltungselektronik

Leiterplatten für Heimelektronik

Application fit requires project evidence; no customer relationship is implied.

-04Capabilities Summary

Capability data

DatasetParameterSampleMass production

Conventional rigid PCB capabilityLayer Count50L36L

Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm

Conventional rigid PCB capabilityThickness Tolerance±8%±8%

Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil

Flexible PCB capabilityLayer Count1216

Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5

Flexible PCB capabilityMinimum BGA Pitch (μm)150100

Flexible PCB capabilityMinimum Board Thickness (μm)5050

Rigid-flex PCB capabilityLayer Count20L18L

Rigid-flex PCB capabilityPanel Size400×540mm400×540mm

Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm

Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil

High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber

High-frequency and high-speed PCB capabilityLayer Count24L20L

High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm

High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-05RFQ

Send the board specification for engineering review

Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.

Gerber-Daten senden Angebot anfordern