-01Produkte

Multilayer-Leiterplattenfertigung

Prüfen Sie die Möglichkeiten für „Multilayer-Leiterplattenfertigung“, die benötigten Projektdaten und die für Ihren Auftrag zu bestätigenden Angaben.

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Komplexe unbestückte Leiterplatte mit dichter Leiterführung

-02Capabilities Multilayer

Capability data

DatasetParameterSampleMass production

Conventional rigid PCB capabilityLayer Count50L36L

Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm

Conventional rigid PCB capabilityThickness Tolerance±8%±8%

Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil

Conventional rigid PCB capabilityMin Hole-to-Trace Clearance5mil5mil

Conventional rigid PCB capabilityCopper Weight1-12oz1/3-8oz

Conventional rigid PCB capabilityLayer Registration Accuracy0.8mil1mil

Conventional rigid PCB capabilityMin Through Hole Diameter0.075mm0.10mm

Conventional rigid PCB capabilityMin Blind/Buried Via Diameter0.05mm0.075mm

Conventional rigid PCB capabilityMax Aspect Ratio35:130:1

Conventional rigid PCB capabilityEtching Tolerance±10%/±0.8mil±10%/±1mil

Conventional rigid PCB capabilityMin Solder Bridge2mil3mil

Conventional rigid PCB capabilityImpedance Control Tolerance±5%±7%

Conventional rigid PCB capabilityHDI Level9th Order5th Order

Conventional rigid PCB capabilitySurface FinishENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, CarbonENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon

Conventional rigid PCB capabilityMaterial TypesShengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free)Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free)

The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.

-03Products Pcb