-01Produkte
Leiterplattenfertigung nach Kundenspezifikation
Prüfen Sie die Möglichkeiten für „Leiterplattenfertigung nach Kundenspezifikation“, die benötigten Projektdaten und die für Ihren Auftrag zu bestätigenden Angaben.
-02Capabilities Pcb
Capability data
DatasetParameterSampleMass production
Conventional rigid PCB capabilityLayer Count50L36L
Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm
Conventional rigid PCB capabilityThickness Tolerance±8%±8%
Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
Conventional rigid PCB capabilityMin Hole-to-Trace Clearance5mil5mil
Conventional rigid PCB capabilityCopper Weight1-12oz1/3-8oz
Conventional rigid PCB capabilityLayer Registration Accuracy0.8mil1mil
Conventional rigid PCB capabilityMin Through Hole Diameter0.075mm0.10mm
Conventional rigid PCB capabilityMin Blind/Buried Via Diameter0.05mm0.075mm
Conventional rigid PCB capabilityMax Aspect Ratio35:130:1
Conventional rigid PCB capabilityEtching Tolerance±10%/±0.8mil±10%/±1mil
Conventional rigid PCB capabilityMin Solder Bridge2mil3mil
Conventional rigid PCB capabilityImpedance Control Tolerance±5%±7%
Conventional rigid PCB capabilityHDI Level9th Order5th Order
Conventional rigid PCB capabilitySurface FinishENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, CarbonENIG, Hard Gold, Immersion Tin, Immersion Silver, OSP, Carbon
Conventional rigid PCB capabilityMaterial TypesShengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free)Shengyi, Taiwan Union, ITEQ, NanYa, Rogers, Panasonic, Isola (TG135/TG150/TG170, CAF/CTI>600, Halogen Free)
The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.
-03Products Pcb
Approved media
-04Capabilities Manufacturing Range
Capability data
DatasetParameterSampleMass production
Conventional rigid PCB capabilityLayer Count50L36L
Conventional rigid PCB capabilityFinished Board Thickness0.2-15.0mm0.3-7.0mm
Conventional rigid PCB capabilityThickness Tolerance±8%±8%
Conventional rigid PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
Flexible PCB capabilityLayer Count1216
Flexible PCB capabilityMinimum Dielectric Thickness (μm)12.512.5
Flexible PCB capabilityMinimum BGA Pitch (μm)150100
Flexible PCB capabilityMinimum Board Thickness (μm)5050
Rigid-flex PCB capabilityLayer Count20L18L
Rigid-flex PCB capabilityPanel Size400×540mm400×540mm
Rigid-flex PCB capabilityFinished Board Thickness0.25-5.0mm0.25-3.2mm
Rigid-flex PCB capabilityMin Trace/Space1.5mil/1.5mil2mil/2mil
High-frequency and high-speed PCB capabilityMaterial SystemPTFE, Hydrocarbon Resin, Other MaterialsPTFE+Ceramic, PTFE+Glass Fiber+Ceramic, PTFE+Glass Fiber
High-frequency and high-speed PCB capabilityLayer Count24L20L
High-frequency and high-speed PCB capabilityPanel Size850×700mm720×650mm
High-frequency and high-speed PCB capabilityProfile Tolerance±0.05mm±0.10mm
The latest supplied columns are from 2023 and require factory confirmation before publication or quotation.
-05Process
Vom Prototyp zur Serie
- 01
Datenprüfung
- 02
Technische Rückfragen
- 03
Bestätigung von Lagenaufbau und Material
- 04
Fertigung
- 05
Inspektion und Prüfung
- 06
Verpackung und Lieferung
-06RFQ
Send the board specification for engineering review
Send Gerber, ODB++, BOM, drawings, stack-up, quantity, and target delivery where applicable. Lead time and commercial terms are confirmed per order.